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32414nk/o2611sy 20111018-s00003/82411sy 20110718-s00006 no.a1972-1/14 semiconductor components industries, llc, 2014 march, 2014 http://onsemi.com ordering information see detailed ordering and shipping informa tion on page 14 of this data sheet. lv5695p overview the lv5695p is a multiple output linear regulator ic, whic h allows reduction of quiescent current. the lv5695p is specifically designed to address automotive infotainment sy stems power supply requirements. the lv5695p integrates 5 linear regulator outputs, 2 high side power switches, over current protection, overvoltage protection and thermal shutdown circuitry. function ? quiescent current 50 a (typ. when only vdd is in operation) ? five channel regulator for v dd : v out is 5.0v/3.3v(operation always), i o max is 300ma for swd5v: v out is 5.0v, i o max is 500ma for cd: v out is 8.0v, i o max is 2000ma for illumination: v out is 8.5v, i o max is 500ma for audio systems: v out is 8.45v, i o max is 800ma ? two high side switch: amp: voltage difference between input and output is 0.5v, i o max is 500ma ant: voltage difference between input and output is 0.5v, i o max is 350ma ? over current protector ? overvoltage protector (without v dd -out) clamp voltage is 28v (typical) ? thermal shut down 175oc (typical) ? pch-ldmos is used for power output block. (warning) the protector functions only improve the ic?s tole rance and they do not guarantee the safety of the ic if used under the conditions out of safety range or ratings. use of the ic such as use under over current protection range or thermal shutdown st ate may degrade the ic?s reliability and eventually damage the ic. orderin g numbe r : ena1972b bi-cmos ic system power supply ic for automotive infotainment multiple output linear voltage regulator hzip15j
lv5695p no.a1972-2/14 specifications absolute maximum ratings at ta = 25 c parameter symbol conditions ratings unit power supply voltage v cc max 36 v power dissipation pd max (*1) ic unit 1.5 w at using al heat sink (50 50 1.5mm 3 ) 5.6 w at infinity heat sink 32.5 w peak voltage v cc peak regarding bias wave, refe r to below the pulse. 50 v operating temperature topr -40 to +85 c storage temperature tstg -55 to +150 c junction temperature tj max 150 c *1 : ta 25 c recommended operating conditions at ta = 25 c parameter conditions ratings unit power supply voltage rating 1 v dd output on, swd output on 7 to 16 v power supply voltage rating 2 ilm output on 10.3 to 16 v power supply voltage rating 3 audio output on, cd output on 10 to 16 v * v cc 1 should be as follows: v cc 1>v cc -0.7v electrical characteristics at ta = 25c(*2), v cc = v cc 1=14.4v parameter symbol conditions ratings unit min typ max current drain i cc v dd no load, ctrl1/2/3 = ? l/l/l ? 50 100 a ctrl1/2/3 input low input voltage v il 1 0 0.3 v middle input voltage 1 v im 1 0.8 1.06 1.4 v middle input voltage 2 v im 2 1.9 2.13 2.4 v high input voltage v ih 2.9 3.2 5.5 v input impedance r in input voltage 3.3v 280 400 520 k ikv dd input. low input voltage v il 2 - - 0.7 v high input voltage v ih 2 ikv dd v cc 1-0.7 - - v v dd output(5v/3.3v) output voltage v o 11 i o 1 = 200ma, ikv dd = v cc 1 4.85 5.0 5.15 v v o 12 i o 1 = 200ma, ikv dd = gnd 3.2 3.3 3.4 v output current i o 1 v o 11 4.7v, v o 12 3.1v 300 ma line regulation v oln 1 7.5v < v cc 1 < 16v, i o 1 = 200ma 30 70 mv load regulation v old 1 1ma < i o 1 < 200ma 70 150 mv dropout voltage 1 v drop 1 i o 1 = 200ma (v dd output 5v time) 0.8 1.6 v dropout voltage 2 v drop 1 ? i o 1 = 100ma (v dd output 5v time) 0.4 0.8 v ripple rejection r rej 1 f = 120hz, i o 1 = 200ma 30 40 db audio (8.45v) output ; ctrl2 = ? m1 or h ? audio output voltage 1 v o 3 i o 3 = 650ma 8.196 8.45 8.7 v audio output current i o 3 v o 3 8.0v 800 ma line regulation v oln 3 10v < v cc < 16v, i o 3 = 650ma 30 90 mv load regulation v old 3 1ma < i o 3 < 650ma 100 200 mv dropout voltage 1 v drop 3 i o 3 = 650ma 0.7 1.2 v dropout voltage 2 v drop 3 ? i o 3 = 200ma 0.2 0.35 v ripple rejection r rej 3 f = 120hz, i o 3 = 650ma 40 50 db continued on next page. stresses exceeding those listed in the maximum ratings table may damage the device. if any of these limits are exceeded, device functionality should n ot be assumed, damage may occur and reliability may be affected. functional operation above the stresses listed in the recommended operating ranges is not implied. extended exposure to stresses beyond the recomme nded operating ranges limits may affect device r eliab ility.
lv5695p no.a1972-3/14 continued from preceding page parameter symbol conditions ratings unit min typ max ilm (8.5v) output ; ctrl1 = ? m1 or h ? ilm output voltage v o 4 i o 4 = 350ma 8.245 8.5 8.755 v ilm output current i o 4 v o 4 8.1v 500 ma line regulation v oln 4 10.8v < v cc < 16v, i o 4 = 350ma 40 100 mv load regulation v old 4 1ma < i o 4 < 350ma 70 150 mv dropout voltage 1 v drop 4 i o 4 = 350ma 1.0 1.5 v dropout voltage 2 v drop 4 ? i o 4 = 100ma 0.3 0.6 v ripple rejection r rej 4 f = 120hz, i o 4 = 350ma 40 50 db amp_hs-sw; ctrl3 = ? m2 or h ? output voltage v o 5 i o 5 = 500ma v cc -0.5 v cc -1.0 v output current i o 5 v cc -1.0 v o 5 500 ma ant_hs-sw; ctrl3 = ? m1 or h ? output voltage v o 6 i o 6 = 300ma v cc -0.5 v cc -1.0 v output current i o 6 v cc -1.0 v o 6 350 ma swd5v; ctrl2 = ? m2 or h ? swd output voltage v o 7 i o 7 = 350ma 4.85 5.0 5.15 v swd output current i o 7 v o 7 4.7v 500 ma line regulation v oln 7 10v < v cc < 16v, i o 7 = 350ma 30 70 mv load regulation v old 7 1ma < i o 7 < 350ma 70 150 mv dropout voltage v drop 7 i o 7 = 350ma 0.8 1.6 v ripple rejection r rej 7 f = 120hz, i o 7 = 350ma 40 50 db cd(8.0v output); ctrl1 = ? m2 or h ? cd output voltage v o 81 i o 8 = 1300ma 7.76 8.0 8.24 v cd output current i o 8 v o 81 7.6v 2000 ma line regulation v oln 8 10.5v < v cc < 16v, i o 8 = 1300ma 40 100 mv load regulation v old 8 10ma < i o 8 < 1300ma 70 200 mv dropout voltage 1 v drop 8 i o 8 = 1300ma 1.3 1.95 v dropout voltage 2 v drop 8? i o 8 = 350ma 0.35 0.7 v ripple rejection r rej 8 f = 120hz, i o 8 = 1300ma 40 50 db *2: the entire specification has been defined based on th e tests performed under the conditions where tj and ta (=25 c) are almost equal. there tests were performed with pulse load to minimize t he increase of junction temperature (tj). product parametric performance is indicated in the electrical characteristics for the listed test conditions, unless otherwise noted. product per formance may not be indicated by the electrical characteristics if operated under different conditions.
lv5695p no.a1972-4/14 package dimensions unit : mm hzip15j case 945ac issue a xxxxxxxxxx ymddd xxxxx = specific device code y = year m = month ddd = additional traceability data generic marking diagram* soldering footprint* note: the measurements are not to guarantee but for reference only. through hole area package name hzip15j (unit: mm) *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. 1.2 2.54 2.54 2.54 (1.91) 2.54
lv5695p no.a1972-5/14 ? allowable power dissipation derating curve ? waveform applied during surge test 100msec 5msec 16v 50v 10% 90% 0 7 2 1 1.5 4 3 5 5.6 6 8 0 20 140 150 80 100 60 120 40 160 aluminum heat sink (50 50 1.5mm 3 ) when using pd max -- ta ambient temperature, ta -- c allowable power dissipation, pd max -- w independent ic aluminum heat sink mounting conditions tightening torque : 39n ? cm, using silicone grease
lv5695p no.a1972-6/14 ctrl pin output truth table(each output can be independently controlled by four value input.) inamp inant ctrl3 amp ant l l l off off l h m1 off on h l m2 on off h h h on on ctrl2 swd5v audio ctrl1 cd ilm l off off l off off m1 off on m1 off on m2 on off m2 on off h on on h on on (warning) usage of ctrl2 when ctrl pin transits between l and m2, since it passes m1 , ilm,/audio/ant is turned on for a moment. likewise, when ctrl pin transits between h and m1, since it pa sses m2, ilm/audio/ant is turned off for a moment. to avoid operation failure by the above factor s, please refer to the following precautions. ? do not connect parasitic capacitor to ctrl as much as possible. ? if use of capacitor for ctrl is required, k eep the resistance value as low as possible. ? make sure that the output load capacitor has enough marjin against the voltage fluctuation due to instantaneous on/off. inamp inant ctl3
lv5695p no.a1972-7/14 z block diagram + - amp out + - + - thermal shut down output control 300ma v cc gnd start up vref over voltage protection ctrl1 ctrl2 ctrl3 amp_sw(v cc -0.5v) 500ma 500ma 800ma + - + - 2000ma v cc ant out ant_sw(v cc -0.5v) 350ma 500ma ilm output(8.5v) audio output(8.45v) swd output(5v) cd output(8v) v cc 1(v dd power supply input) v dd output(3.3/5v) ikv dd :v dd (3.3/5v) changeing pin ikv dd =v cc 1:5v ikv dd =gnd:3.3v
lv5695p no.a1972-8/14 pin function pin no. pin name description equivalent circuit 1 ilm ilm output pin on when ctrl1 = m1, h 8.5v/0.5a 15 2 v cc gnd 1 2 gnd gnd pin 3 cd cd output pin on when ctrl1 = m2, h 8.0v/2a 15 2 v cc gnd 3 4 6 8 ctrl1 ctrl2 ctrl3 ctrl1/2/3 input pin four values input v cc 15 2 gnd 6 4 8 5 audio audio output pin on when ctrl2 = m1, h 8.45v/0.8a 15 2 v cc gnd 5 continued on next page.
lv5695p no.a1972-9/14 continued from preceding page. pin no. pin name description equivalent circuit 7 swd swd output pin on when ctrl2 = m2, h 5v/0.5a 15 2 v cc gnd 7 9 ant ant output pin on when ctrl3 = m1, h v cc -0.5v/350ma 15 2 v cc gnd 9 11 11 ext output pin on when ctrl2 = m2, h v cc -0.5v/500ma 10 nc (gnd) 12 ikv dd v dd voltage change control input pin v cc 1/gnd 14 2 v cc gnd 12 13 v dd v dd output pin 5.0v/0.3a(ikv dd = v cc 1) 3.3v/0.3a(ikv dd = gnd) 14 2 v cc gnd 13 14 v cc 1 v dd power supply pin 2 v cc 1 gnd 15 14 v cc 15 v cc power supply pin
lv5695p no.a1972-10/14 timing chart 28v v cc (15pin) v cc 1 (14pin) 28v 5.8v l m1 h l m2 h l m1 m1 m2 m2 h v dd output (5v time) (13pin) ctrl1 input (4pin) ctrl2 input (6pin) ctrl3 input (8pin) audio output (5pin) swd output (7pin) cd output (3pin) ilm output (1pin) *usage condition: use under typical value. ant output (9pin) amp output (11pin)
lv5695p no.a1972-11/14 example of applied circuit peripheral parts list name of part description recommended value remarks c2, c4, c6, c8, c12 output stabilization capacitor 10 f or more* electrolytic capacitor c1, c3, c5, c7, c11 output stabilization capacitor 0.22 f or more* ceramic capacitor c14, c16 power supply bypass capacitor 100 f or more these capacitors must be placed near the v cc and gnd pins. c13, c15 oscillation prevention capacitor 0.22 f or more c9, c10 amp/ant output stabilization capacitor 2.2 f or more r1 resistance for protection 10 to 100k d1 diode for prevention of backflow d2, d3, d4, d5 diode for internal element protection sb1003m3 note)the circuit diagram and the values are only tentative which are subject to change. * : make sure that the capacitors of the output pins are 10 f or higher and esr is 10 ? or lower in total and temperature characteristics and accuracy are taken into consideration. also the e-cap should have good high frequency characteristics. caution for implementing lv5695p to a system board the package of lv5695p is hzip15j which has some metal exposure s other than connection pins an d heatsink as shown in the diagram below. the electrical potentials of (2) and (3) are the same as those of pin 15 and pin 1, respectively. (2) (=pin 15) is the v cc pin and (3) (=pin 1) is the ilm (regulator) output pin. when you implement the ic to the set board, make sure that the bolts an d the heatsink are out of touch from (2) and (3). if the metal exposur es touch the bolts which has th e same electrical potential with gnd, gnd short occurs in ilm output and v cc . the exposures of (1) are connected to heatsi nk which has the same el ectrical potential with substrate of the ic chip (gnd). therefore, (1) and gnd el ectrical potential of the set board can connect each other. hzip15j outline 1 2 3 1 1 heat-sink same potential 15pin same potential 1pin same potential heat-sink same potential heat-sink side :metal exposure heat-sink side heat-sink same potential :metal exposure + 14 12 10 8 ctrl1 6 ctrl2 4 swd 2 15 13 11 9 7 5 3 1 amp gnd v cc audio cd ilm + c8 c7 ilm + cd ctrl2 ctrl3 d1 c4 c3 d5 d4 c10 amp + audio c1 c2 swd ctrl3 ant (nc) ikv dd v dd v cc 1 ctrl1 + c6 c5 v cc + + + v dd r1 c12 c11 c13 c14 c15 c16 + d3 d2 c9 ant
lv5695p no.a1972-12/14 frame diagram (lv5695p) *in the sy stem power supply other than lv 5695p, pin assignment may differ. 1pin 15pin metal exposure 1 metal exposure 3 metal exposure 2 metal exposure 1 metal exposure 1 metal exposure 1 lv5695
lv5695p no.a1972-13/14 hzip15j heat sink attachment heat sinks are used to lower the semiconductor device junction temperature by leading the head generated by the device to the outer environment and dissipating that heat. a. unless otherwise specified, for power ics with tabs and pow er ics with attached heat sinks, solder must not be applied to the heat sink or tabs. b. heat sink attachment use flat-head screws to attach heat sinks. use also washer to protect the package. use tightening torques in the ranges 39-59ncm(4-6kgcm) . if tapping screws are used, do not use screws with a diameter larger than the holes in the semiconductor device itself. do not make gap, dust, or other contaminants to get between the semiconductor device and the tab or heat sink. take care a position of via hole . do not allow dirt, dust, or other contaminants to get between the semiconductor device and the tab or heat sink. verify that there are no press burrs or screw-hole burrs on the heat sink. warping in heat sinks and printed circuit boards must be no more than 0.05 mm between screw holes, for e ither concave or co nvex warping. twisting must be limited to under 0.05 mm. heat sink and semiconductor device are mounted in parallel. take care of electric or compressed air drivers the speed of these torque wrenches should never exceed 700 rpm, and should typically be about 400 rpm. c. silicone grease spread the silicone grease evenly when mounting heat sinks. our company recommends yg-6260 (mom entive performance materials japan llc) d. mount first mount the heat sink on the semiconductor device, and then mount that assembly on the printed circuit board. when attaching a heat sink after mounting a semiconductor device into the printed circuit board, when tightening up a heat sink with the screw, the mechanical stress which is impossible to the semiconductor device and the pin doesn't hang. e. when mounting the semiconductor device to the heat sink using jigs, etc., take care not to allow the device to ride onto the jig or positioning dowel. design the jig so that no unreason able mechanical stress is not applied to the semiconductor device. f. heat sink screw holes be sure that chamfering and shear drop of heat sinks must not be larger than the diameter of screw head used. when using nuts, do not make the heat sink hole diameters larger than the diameter of the head of the screws used. a hole diameter about 15% larger than the diameter of the screw is desirable. when tap screws are used, be sure that the diameter of th e holes in the heat sink are not too small. a diameter about 15% smaller than the diameter of the screw is desirable. g. there is a method to mount the semiconductor device to the heat sink by using a spring band. but this method is not recommended because of possible displacement due to fluc tuation of the spring force with time or vibration. binding head machine screw countersunk head mashine screw heat sink gap via hole
lv5695p ps no.a1972-14/14 ordering information device package shipping (qty / packing) lv5695p-e hzip15j (pb-free) 20 / fan-fold on semiconductor and the on logo are registered trademarks of semiconductor components industries, llc (scillc). scillc owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. a listing of scillc?s product/patent coverage may be accessed at www.onsemi.com/site/pdf/patent-marking.pdf. scillc reserves the right to make changes without further notice to any products herein. scillc mak es no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does scillc assume any liab ility arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequentia l or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s techn ical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use a s components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other applica tion in which the failure of the scillc product could create a situation where personal injury or death may occur. should buyer purchase or use scillc products for an y such unintended or unauthorized application, buyer shall indemnify and hold scillc and its officers, employees, subsidiaries, affiliates, and dis tributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of persona linjuryor death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture o fthe part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale i n any manner.

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